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Electrical Characteristics (T A = 25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I S
Maximum Continuous Drain-Source Diode Forward Current
-1.3
A
V SD
Drain-Source Diode Forward Voltage
V GS = 0 V, I S = -1.3 A
(Note 2)
-0.85
-1.2
V
t rr
Reverse Recovery Time
V GS = 0 V, I F = -1.3 A, dI F /dt = 100 A/μs
100
ns
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θ JC is guaranteed by
design while R θ CA is determined by the user's board design.
P D ( t ) =
T J ? T A
R θ J A ( t )
=
T J ? T A
R θ J C + R θ CA ( t )
= I 2 D ( t ) × R DS ( ON )
T J
Typical R θ JA for single device operation using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment:
a. 78 o C/W when mounted on a 0.5 in 2 pad of 2oz copper.
b. 125 o C/W when mounted on a 0.02 in 2 pad of 2oz copper.
c. 135 o C/W when mounted on a 0.003 in 2 pad of 2oz copper.
1a
1b
1c
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300μs, Duty Cycle < 2.0%..
NDS8947.SAM
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